The invention relates to an electrical enclosure arrangement comprising an electrical enclosure line and a cooling device connected into the line. The electrical enclosure line is formed from multiple electrical enclosures which are connected together. The invention is characterized in that the cooling device suctions hot air out of the electrical enclosures via two opposite faces, each of the faces of the cooling device adjoining a respective electrical enclosure, and blows the air back into the electrical enclosures as cooled air. At least one busbar is guided through a busbar transfer area of the cooling device between the electrical enclosures adjoining the cooling device.