Invention Grant
- Patent Title: Water-cooled distributive heat dissipation system for rack
-
Application No.: US16655184Application Date: 2019-10-16
-
Publication No.: US11044832B2Publication Date: 2021-06-22
- Inventor: Yen-Chia Huang , Chun-Hung Lin
- Applicant: TAIWAN MICROLOOPS CORP.
- Applicant Address: TW New Taipei
- Assignee: TAIWAN MICROLOOPS CORP.
- Current Assignee: TAIWAN MICROLOOPS CORP.
- Current Assignee Address: TW New Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Priority: TW108104276 20190201
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A water-cooled pressurized distributive heat dissipation system includes a water tank having a distributing duct, branch modules separately corresponding to the servers and a converging duct. Each branch module has a branch pipe inserted into a corresponding one of the servers and a water block connecting to the branch pipe. An end of each of the branch pipe connects to the distributing duct in order. The converging duct connects to another end of each branch pipe in order. A working fluid is accommodated in the water tank and driven by a pump to flow toward the distributing duct to the branch modules and the converging duct. A flow direction of the working fluid in the distributing duct is the same as a flow direction of the working fluid in the converging duct.
Public/Granted literature
- US20200253088A1 WATER-COOLED DISTRIBUTIVE HEAT DISSIPATION SYSTEM FOR RACK Public/Granted day:2020-08-06
Information query