Invention Grant
- Patent Title: Hybrid source drain regions formed based on same Fin and methods forming same
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Application No.: US16515484Application Date: 2019-07-18
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Publication No.: US11049774B2Publication Date: 2021-06-29
- Inventor: Pei-Hsun Wang , Shih-Cheng Chen , Chun-Hsiung Lin , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L21/8238 ; H01L27/092 ; H01L21/306 ; H01L21/3065

Abstract:
A method includes forming an epitaxy semiconductor layer over a semiconductor substrate, and etching the epitaxy semiconductor layer and the semiconductor substrate to form a semiconductor strip, which includes an upper portion acting as a mandrel, and a lower portion under the mandrel. The upper portion is a remaining portion of the epitaxy semiconductor layer, and the lower portion is a remaining portion of the semiconductor substrate. The method further includes growing a first semiconductor fin starting from a first sidewall of the mandrel, growing a second semiconductor fin starting from a second sidewall of the mandrel. The first sidewall and the second sidewall are opposite sidewalls of the mandrel. A first transistor is formed based on the first semiconductor fin. A second transistor is formed based on the second semiconductor fin.
Public/Granted literature
- US20210020524A1 Hybrid Source Drain Regions Formed Based on Same Fin and Methods Forming Same Public/Granted day:2021-01-21
Information query
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