Invention Grant
- Patent Title: Level shifting between interconnected chips having different voltage potentials
-
Application No.: US16540181Application Date: 2019-08-14
-
Publication No.: US11049830B2Publication Date: 2021-06-29
- Inventor: Chad Andrew Marquart , Daniel M. Dreps
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Aaron N. Pontikos
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/538 ; H01L23/528 ; H03K19/0185 ; H01L21/48 ; H01L25/065
Abstract:
An input/output (I/O) interface of a die is disclosed. The I/O interface of the die includes a first region of a backside of the die. The I/O interface further includes a second region of the backside surface of the die positioned along at least a portion of a perimeter of the first region. The second region provides power and ground connections to the first region.
Public/Granted literature
- US20210050318A1 LEVEL SHIFTING BETWEEN INTERCONNECTED CHIPS HAVING DIFFERENT VOLTAGE POTENTIALS Public/Granted day:2021-02-18
Information query
IPC分类:
