Invention Grant
- Patent Title: Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection
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Application No.: US15688369Application Date: 2017-08-28
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Publication No.: US11049841B2Publication Date: 2021-06-29
- Inventor: William Emmett Bernier , Bing Dang , Mario J. Interrante , John Knickerbocker , Son Kim Tran
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt, Wallace & Kammer, LLP
- Agent Daniel Morris
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/552 ; H01L23/60 ; H01L23/00 ; H01L25/065 ; H01L23/367
Abstract:
A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.
Public/Granted literature
- US20170358552A1 Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shielding and Protection Public/Granted day:2017-12-14
Information query
IPC分类:
