Invention Grant
- Patent Title: Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas
-
Application No.: US16390427Application Date: 2019-04-22
-
Publication No.: US11050153B2Publication Date: 2021-06-29
- Inventor: Monsen Liu , Lai Wei Chih , Chung-Hao Tsai , Jeng-Shien Hsieh , En-Hsiang Yeh , Chuei-Tang Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/38 ; H01L23/00 ; H01L21/56
Abstract:
A method includes placing a device die and a pre-formed dielectric block over a first carrier, encapsulating the device die and the pre-formed dielectric block in an encapsulating material, grinding a top side of the encapsulating material to expose the top side of the pre-formed dielectric block, removing the carrier from the encapsulating material, the pre-formed dielectric block, and the device die to reveal a bottom side of the pre-formed dielectric block, and forming a ground panel, a feeding line, and a patch on the encapsulating material. The ground panel, the feeding line, the patch, and the pre-formed dielectric block form a patch antenna.
Public/Granted literature
- US20190252783A1 Embedding Low-K Materials in Antennas Public/Granted day:2019-08-15
Information query
