Invention Grant
- Patent Title: Thermally highly conductive coating on base structure accommodating a component
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Application No.: US15879615Application Date: 2018-01-25
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Publication No.: US11051391B2Publication Date: 2021-06-29
- Inventor: Mikael Tuominen , Annie Tay , Artan Baftiri
- Applicant: AT&S (China) Co. Ltd.
- Applicant Address: CN Shanghai
- Assignee: AT&S (China) Co. Ltd.
- Current Assignee: AT&S (China) Co. Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: CN2017-10061261.8 20170125
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L23/00 ; H01L23/373 ; H05K7/20 ; H01L23/538 ; H01L21/56 ; H01L23/31
Abstract:
A component carrier has a base structure with a recess, a thermally highly conductive coating covering at least a part of a surface of the base structure, and a component in the recess.
Public/Granted literature
- US20180213634A1 Thermally Highly Conductive Coating on Base Structure Accommodating a Component Public/Granted day:2018-07-26
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