Invention Grant
- Patent Title: Method for assembling an electronic device
-
Application No.: US16131137Application Date: 2018-09-14
-
Publication No.: US11051415B2Publication Date: 2021-06-29
- Inventor: Sheng-Wen Wu , Yu-Cheng Huang , Ke-Hua Lin , Shao-Chi Chuang , Wen-Shu Lee
- Applicant: Acer Incorporated
- Applicant Address: TW New Taipei
- Assignee: Acer Incorporated
- Current Assignee: Acer Incorporated
- Current Assignee Address: TW New Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW104129125 20150903
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H05K5/00
Abstract:
A method for assembling the electronic device is provided, including providing a band member, forming a buffer structure on the band member by overmolding, pulling the band member out of the buffer structure to form a channel in the buffer structure, providing a flexible circuit, and disposing the flexible circuit through the channel.
Public/Granted literature
- US20190014673A1 ELECTRONIC DEVICE AND ASSEMBLY METHOD THEREOF Public/Granted day:2019-01-10
Information query
