Invention Grant
- Patent Title: Multi-layer expansion card buffer bracket
-
Application No.: US16475094Application Date: 2018-06-13
-
Publication No.: US11051423B2Publication Date: 2021-06-29
- Inventor: Baolong Gong
- Applicant: ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY CO., LTD.
- Applicant Address: CN Henan
- Assignee: ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY CO., LTD.
- Current Assignee: ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Henan
- Agency: Apex Attorneys at Law, LLP
- Agent Yue (Robert) Xu
- Priority: CN201710832540.X 20170915
- International Application: PCT/CN2018/090981 WO 20180613
- International Announcement: WO2019/052240 WO 20190321
- Main IPC: H05K7/14
- IPC: H05K7/14 ; F16F1/12 ; F16F3/10 ; F16F15/08 ; F16M13/02

Abstract:
A buffer bracket for multi layers of expansion cards is provided, which includes: an elastic base, a first supporting plate and a plurality of second supporting plates which are sequentially arranged from bottom to top, wherein the first supporting plate is fixedly connected to the elastic base, the first supporting plate is slidably connected to the adjacent second supporting plate, and the adjacent second supporting plates are slidably connected.
Public/Granted literature
- US20190335605A1 MULTI-LAYER EXPANSION CARD BUFFER BRACKET Public/Granted day:2019-10-31
Information query