Invention Grant
- Patent Title: Component supply device
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Application No.: US16322046Application Date: 2016-08-08
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Publication No.: US11051440B2Publication Date: 2021-06-29
- Inventor: Kazuyoshi Oyama , Ryouta Masuda , Koji Yamazumi , Haruyasu Fujita
- Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Applicant Address: JP Iwata
- Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee Address: JP Iwata
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2016/073311 WO 20160808
- International Announcement: WO2018/029754 WO 20180215
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04 ; H05K13/02

Abstract:
A component supply device supplies components stored in a component storage tape to a component extracting position. The component supply device includes a component exposing unit that exposes the components in the component storage tape fed by a tape feeding unit, the component storage tape traveling on a travel path formed from a tape travel path forming unit. The component exposing unit includes a cover tape raising unit that performs a raising process for a cover tape. In the travel path formed from the tape travel path forming unit, a first path part on which the cover tape raising unit is disposed is inclined to one direction side in a Z-axis direction from an upstream side toward a downstream side in a tape feeding direction.
Public/Granted literature
- US20190191604A1 COMPONENT SUPPLY DEVICE Public/Granted day:2019-06-20
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