Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US16361309Application Date: 2019-03-22
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Publication No.: US11052432B2Publication Date: 2021-07-06
- Inventor: Masayuki Hayashi , Nobuyuki Shibayama , Toru Endo
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JPJP2018-057501 20180326,JPJP2018-206627 20181101
- Main IPC: B08B3/08
- IPC: B08B3/08 ; B01F3/08 ; H01L21/67

Abstract:
A first SPM, prepared by mixing sulfuric acid and hydrogen peroxide water at a first mixing ratio, is supplied to a substrate. A second SPM, prepared by mixing the sulfuric acid and the hydrogen peroxide water at a second mixing ratio greater than the first mixing ratio, is supplied to the substrate after the supply of the first SPM is stopped. The first SPM expelled from the substrate flows into a drain piping. The second SPM expelled from the substrate flows into a recovery piping. SPM is prepared by mixing the hydrogen peroxide water with sulfuric acid contained in the second SPM guided by the recovery piping.
Public/Granted literature
- US20190308224A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2019-10-10
Information query
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