- Patent Title: Copper-coated magnesium wire and method for manufacturing the same
-
Application No.: US16301486Application Date: 2017-03-22
-
Publication No.: US11052442B2Publication Date: 2021-07-06
- Inventor: Hiroshi Kitazawa , Takuya Sakita
- Applicant: TOTOKU ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOTOKU ELECTRIC CO., LTD.
- Current Assignee: TOTOKU ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2016-122825 20160621
- International Application: PCT/JP2017/011358 WO 20170322
- International Announcement: WO2017/221485 WO 20171228
- Main IPC: B21C1/02
- IPC: B21C1/02 ; B21C1/00 ; C25D7/06 ; H01B5/02 ; H01B13/00

Abstract:
To provide a copper-coated magnesium wire which meets the demand for a lightweight coil wire material, and a method for manufacturing the same. The above-described problem is solved by a copper-coated magnesium wire (10) comprising a core material (1) made of magnesium, and a copper coating layer (2) made of copper or a copper alloy provided on a surface of the core material (1). In the copper-coated magnesium wire (10), a wire drawing mark is present on a surface of the copper coating layer (2), and the diameter is preferably within a range of 0.03 to 0.08 mm, inclusive. Further, a thickness of the copper coating layer (2) is preferably within a range of 5 to 30%, inclusive, as a ratio of the overall cross-sectional area. An insulating coating layer (3) may be provided on an outer circumferential side of the copper coating layer (2).
Public/Granted literature
- US20190283097A1 COPPER-COATED MAGNESIUM WIRE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-09-19
Information query