Invention Grant
- Patent Title: Centerless grinding apparatus and work grinding condition monitoring method
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Application No.: US16138243Application Date: 2018-09-21
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Publication No.: US11052508B2Publication Date: 2021-07-06
- Inventor: Mohee Sagae , Satoshi Kobayashi , Katsuyuki Takeda
- Applicant: MICRON MACHINERY CO., LTD.
- Applicant Address: JP Yamagata
- Assignee: MICRON MACHINERY CO., LTD.
- Current Assignee: MICRON MACHINERY CO., LTD.
- Current Assignee Address: JP Yamagata
- Agency: Carrier Blackman & Associates, P.C.
- Agent Joseph P. Carrier; William D. Blackman
- Priority: JPJP2017-189045 20170928
- Main IPC: B24B5/18
- IPC: B24B5/18 ; B24B5/30 ; B24B5/307 ; B24B49/02 ; B24B49/16 ; B24B49/18 ; B24B53/04

Abstract:
When a work W rotates counterclockwise about an axis Ow and is subjected to infeed grinding by a regulating wheel (1) which rotates clockwise about an axis O1 and a grinding wheel (2) which rotates clockwise about an axis O2, a load F acting on a blade (4), a load acting on the work W supported by the blade (4), and a load operating position y in the blade (4) at any given time are measured by a controller (20) based on the outputs of a first stress sensor S1 and a second stress sensor S2 and according to the correlation information stored in a storage device. If the component of a specified frequency extracted by performing frequency analysis of the time series of the load exceeds a threshold value, then designation processing is carried out to reduce the component of the designated frequency to the threshold value or less.
Public/Granted literature
- US20190091831A1 CENTERLESS GRINDING APPARATUS AND WORK GRINDING CONDITION MONITORING METHOD Public/Granted day:2019-03-28
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