Invention Grant
- Patent Title: Gas barrier film and method for producing gas barrier film
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Application No.: US16793450Application Date: 2020-02-18
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Publication No.: US11052642B2Publication Date: 2021-07-06
- Inventor: Eijiro Iwase
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2017-171212 20170906,JPJP2018-108197 20180606
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B7/023 ; B32B27/30 ; B32B27/36 ; B32B37/00 ; C23C16/34

Abstract:
A gas barrier film has, in sequence, a support, an inorganic layer, and a resin film, the inorganic layer and the resin film being supported on the support. The resin film has a hydroxy group. The inorganic layer and the resin film are directly joined to each other with separate portions that are partially present at an interface between the inorganic layer and the resin film. The gas barrier film has one or more sets of a combination of the inorganic layer and the resin film. A method for producing the gas barrier film includes forming an inorganic layer by a gas-phase deposition method, subsequently laminating a resin film having a hydroxy group with the inorganic layer, and heating the resulting film laminate.
Public/Granted literature
- US20200180285A1 GAS BARRIER FILM AND METHOD FOR PRODUCING GAS BARRIER FILM Public/Granted day:2020-06-11
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