A covering assembly is disposed on an inked printing assembly of a stamp. The covering assembly has a top cover and a bottom cover. The top cover is detachably disposed above the inked printing assembly. The bottom cover is detachably disposed below the inked printing assembly, is located below the top cover at a spaced interval, and has a bottom wall. The covering assembly can assist in assembling the inked printing assembly. The disposition of the top cover and the bottom cover can transfer pointed force into planar force for increasing a contact area, the forcing uniformity, and the assembly convenience.