Invention Grant
- Patent Title: Binding structure of wire routing material, and engaging member
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Application No.: US16804338Application Date: 2020-02-28
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Publication No.: US11052839B2Publication Date: 2021-07-06
- Inventor: Toshio Iwahara , Katsuya Hirakawa , Itsuo Wakabayashi , Kazunori Takata
- Applicant: DAIWA KASEI INDUSTRY CO., LTD. , TOYOTA JIDOSHA KABUSHIKI KAISHA
- Applicant Address: JP Okazaki; JP Toyota
- Assignee: DAIWA KASEI INDUSTRY CO., LTD.,TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: DAIWA KASEI INDUSTRY CO., LTD.,TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Okazaki; JP Toyota
- Agency: McClure, Qualey & Rodack, LLP
- Priority: JPJP2019-046113 20190313
- Main IPC: B60R16/02
- IPC: B60R16/02 ; H01B7/00 ; H01B7/40 ; H02G11/00

Abstract:
A binding structure of wire routing materials are formed by: elongated wire routing materials; a binding member for binding the wire routing materials; and an engaging member including a movable body portion including an engaging portion for assembly into a vehicle body, and a bound portion to be bound and held together with the wire routing materials by the binding member. The bound portion includes a main portion facing the wire routing materials, and a leg portion extending from the main portion and being in contact with the wire routing materials. The movable body portion includes a sliding portion disposed such that sliding thereof is allowed on the wire routing materials in a gap.
Public/Granted literature
- US20200290531A1 BINDING STRUCTURE OF WIRE ROUTING MATERIAL, AND ENGAGING MEMBER Public/Granted day:2020-09-17
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