Invention Grant
- Patent Title: Pressure-sensitive adhesive tape
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Application No.: US16254953Application Date: 2019-01-23
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Publication No.: US11053415B2Publication Date: 2021-07-06
- Inventor: Lee Lee Chai
- Applicant: NITTO DENKO MATERIALS (MALAYSIA) SDN. BHD. , NITTO DENKO CORPORATION
- Applicant Address: MY Selangor; JP Ibaraki
- Assignee: NITTO DENKO MATERIALS (MALAYSIA) SDN. BHD.,NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO MATERIALS (MALAYSIA) SDN. BHD.,NITTO DENKO CORPORATION
- Current Assignee Address: MY Selangor; JP Ibaraki
- Agency: United IP Counselors, LLC
- Priority: MYPI2018700312 20180124,MYPI2019000146 20190118
- Main IPC: C09J7/38
- IPC: C09J7/38 ; C09J7/21 ; C09J7/20

Abstract:
A pressure-sensitive adhesive tape comprises a backing layer having a first and a second surface; and a first pressure-sensitive adhesive layer affixed to the first surface; wherein the first pressure-sensitive adhesive layer has an adhesive strength of 2.0 N/10 mm to 9.0 N/10 mm in absence of a solvent and the pressure-sensitive adhesive tape has a tensile strength in longitudinal direction of 45 N/15 mm to 80 N/15 mm.
Public/Granted literature
- US20190225841A1 PRESSURE-SENSITIVE ADHESIVE TAPE Public/Granted day:2019-07-25
Information query
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