Invention Grant
- Patent Title: Method for the fabrication of architected 3D high entropy alloy structures
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Application No.: US15984673Application Date: 2018-05-21
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Publication No.: US11053567B2Publication Date: 2021-07-06
- Inventor: Yang Lu , James Utama Surjadi
- Applicant: City University of Hong Kong
- Applicant Address: HK Kowloon
- Assignee: City University of Hong Kong
- Current Assignee: City University of Hong Kong
- Current Assignee Address: HK Kowloon
- Agency: Renner Kenner Greive Bobak Taylor & Weber
- Main IPC: C22C1/04
- IPC: C22C1/04 ; B22F1/00 ; B22F3/10 ; B22F3/105 ; B22F3/24 ; C22C30/00 ; C22C47/06 ; C22C47/14 ; B22F10/30

Abstract:
A method for the fabrication of architected 3D high entropy alloy structures includes deriving a 3D architecture based on at least one physical property of a high entropy alloy; preparing a fabrication powder including a mixture of two or more metallic powders of nearly equal quantities; arranging a first layer of the fabrication powder on a platform proximate to an energy source; directing energy provided by the energy source to one or more portions of the fabrication powder until portions thereof are sufficiently heated to be melted into one or more solid portions; translating the platform relative to the energy source such that the platform is proximate to the energy source and arranging a second layer of the fabrication powder contiguous to the first layer of fabrication powder on the platform; whereby these steps of arranging, directing, and translating are repeated to form a structure with the derived 3D architecture.
Public/Granted literature
- US20190352743A1 METHOD FOR THE FABRICATION OF ARCHITECTED 3D HIGH ENTROPY ALLOY STRUCTURES Public/Granted day:2019-11-21
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