Invention Grant
- Patent Title: Electroplated Au for conformal coating of high aspect ratio silicon structures
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Application No.: US16174744Application Date: 2018-10-30
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Publication No.: US11053601B2Publication Date: 2021-07-06
- Inventor: Adam M. Rowen , Robert K. Grubbs , Jonathan Joseph Coleman
- Applicant: National Technology & Engineering Solutions of Sandia, LLC
- Applicant Address: US NM Albuquerque
- Assignee: National Technology & Engineering Solutions of Sandia, LLC
- Current Assignee: National Technology & Engineering Solutions of Sandia, LLC
- Current Assignee Address: US NM Albuquerque
- Agent Madelynne J. Farber; Martin I. Finston
- Main IPC: G21K1/00
- IPC: G21K1/00 ; C25D3/48 ; G21K1/06 ; C25D17/02 ; C23C16/455 ; C23C16/18 ; C25D7/12 ; G21K1/02 ; C25D5/18 ; C23C16/04

Abstract:
A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.
Public/Granted literature
- US20190074100A1 Electroplated Au for Conformal Coating of High Aspect Ratio Silicon Structures Public/Granted day:2019-03-07
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