A micro-roughened electrodeposited copper foil and a copper foil substrate are provided. The micro-roughened electrodeposited copper foil includes a micro-rough surface. The micro-rough surface has a plurality of peaks, a plurality of V-shaped grooves and a plurality of micro-crystal clusters. Each of the V-shaped grooves is defined by adjacent two of the peaks and has an average depth less than 1 μm. The micro-crystal clusters are correspondingly located on the tops of the peaks and each thereof has an average height less than 1.5 μm. The micro-rough surface of the micro-roughened electrodeposited copper foil has an Rlr value less than 1.06.