Invention Grant
- Patent Title: Metallic structure and a method for surface treatment of a metallic structure
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Application No.: US16521687Application Date: 2019-07-25
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Publication No.: US11053605B2Publication Date: 2021-07-06
- Inventor: Binbin Zhou , Junda Shen , Yang Yang Li , Jian Lu
- Applicant: City University of Hong Kong
- Applicant Address: HK Kowloon
- Assignee: City University of Hong Kong
- Current Assignee: City University of Hong Kong
- Current Assignee Address: HK Kowloon
- Agency: Renner Kenner Greive Bobak Taylor & Weber
- Main IPC: C25F3/02
- IPC: C25F3/02 ; C25D5/34 ; C25D3/46 ; G01N21/65 ; C25D7/06 ; C25D5/18

Abstract:
A metallic structure and a method for surface treatment of a metallic structure. The method includes the steps of: defining a first surface morphology on a surface of the metallic structure using a first surface treatment process; and manipulating the surface using a second surface treatment process to transform the first surface morphology to a second surface morphology; wherein the metallic structure is substantially made of a first metallic material; and wherein the second surface treatment process includes performing at least one cycle of depositing the first metallic material on the surface of the metallic structure and etching away at least some of the first metallic material from the metallic structure.
Public/Granted literature
- US20210025072A1 METALLIC STRUCTURE AND A METHOD FOR SURFACE TREATMENT OF A METALLIC STRUCTURE Public/Granted day:2021-01-28
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