Invention Grant
- Patent Title: Silicon carbide epitaxial substrate and method for manufacturing silicon carbide semiconductor device
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Application No.: US15780689Application Date: 2016-10-11
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Publication No.: US11053607B2Publication Date: 2021-07-06
- Inventor: Keiji Wada , Tsutomu Hori , Taro Nishiguchi
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Baker Botts L.L.P.
- Agent Michael A. Sartori
- Priority: JPJP2016-026176 20160215
- International Application: PCT/JP2016/080098 WO 20161011
- International Announcement: WO2017/141486 WO 20170824
- Main IPC: B32B3/00
- IPC: B32B3/00 ; C30B29/36 ; C30B25/20 ; H01L21/02 ; C23C16/32 ; C30B25/18 ; H01L21/04 ; H01L21/78 ; H01L29/04 ; H01L29/16 ; H01L29/34 ; H01L29/66 ; H01L29/78

Abstract:
A silicon carbide epitaxial substrate includes a silicon carbide single crystal substrate and a silicon carbide layer. In a direction parallel to a central region, a ratio of a standard deviation of a carrier concentration of the silicon carbide layer to an average value of the carrier concentration of the silicon carbide layer is less than 5%. The average value of the carrier concentration is more than or equal to 1×1014 cm−3 and less than or equal to 5×1016 cm−3. In the direction parallel to the central region, a ratio of a standard deviation of a thickness of the silicon carbide layer to an average value of the thickness of the silicon carbide layer is less than 5%. The central region has an arithmetic mean roughness (Sa) of less than or equal to 1 nm. The central region has a haze of less than or equal to 50.
Public/Granted literature
- US20180363166A1 SILICON CARBIDE EPITAXIAL SUBSTRATE AND METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2018-12-20
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