Invention Grant
- Patent Title: Heat insulating structure body
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Application No.: US16362300Application Date: 2019-03-22
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Publication No.: US11054190B2Publication Date: 2021-07-06
- Inventor: Yoshikatsu Inagaki , Hirofumi Aoki
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2016-186055 20160923
- Main IPC: F28D15/04
- IPC: F28D15/04 ; F28D15/02 ; F25D23/06

Abstract:
A heat insulating structure body comprising: a container which includes a first plate-like body, a second plate-like body facing the first plate-like body, a partition plate for dividing a space between the first plate-like body and the second plate-like body, a first cavity part formed by the first plate-like body and the partition plate, and a second cavity part formed by the second plate-like body and the partition plate, wherein a wick structure body and a working fluid are sealed in the second cavity part.
Public/Granted literature
- US20190219219A1 HEAT INSULATING STRUCTURE BODY Public/Granted day:2019-07-18
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