Invention Grant
- Patent Title: Thickness measurement method, thickness measurement device, defect detection method, and defect detection device
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Application No.: US16047373Application Date: 2018-07-27
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Publication No.: US11054252B2Publication Date: 2021-07-06
- Inventor: Yousuke Irie , Hirotsugu Inoue , Shogo Tokunaga , Yu Kurokawa , Takuya Niioka
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2016-016251 20160129
- Main IPC: G01B21/08
- IPC: G01B21/08 ; G01N25/72 ; G01J5/48 ; G01J5/02 ; G01N25/18 ; G01J5/00

Abstract:
Method for measuring a depth of a defect inside an inspection object is provided. The method comprises steps of: generating thermal image data corresponding to a temperature of a surface of the inspection object by photographing a heated surface of the inspection object at a predetermined time interval by a photographing device; obtaining a temperature curve showing a temporal change in temperature of the surface of the inspection object based on the thermal image data; fitting a theoretical equation obtained from a heat conduction equation including a parameter related to the depth of the defect of the inspection object to the temperature curve to obtain a theoretical curve showing a temporal change in temperature of the surface of the inspection object; and obtaining the depth of the defect of the inspection object based on a value of the parameter in the theoretical equation corresponding to the theoretical curve.
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