Invention Grant
- Patent Title: Thermally isolated thermocouple
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Application No.: US15867451Application Date: 2018-01-10
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Publication No.: US11054315B2Publication Date: 2021-07-06
- Inventor: Anand Rao , Thomas Selkee , Keshava Datta , Thanh Nguyen
- Applicant: Biosense Webster (Israel) Ltd.
- Applicant Address: IL Yokneam
- Assignee: Biosense Webster (Israel) Ltd.
- Current Assignee: Biosense Webster (Israel) Ltd.
- Current Assignee Address: IL Yokneam
- Agency: Dergosits & Noah LLP
- Agent Todd A. Noah
- Main IPC: G01K7/00
- IPC: G01K7/00 ; G01K1/00 ; G01K7/06 ; A61B18/14 ; G01K7/02 ; G01K1/12 ; G01K7/10 ; G01K13/02 ; A61B18/00

Abstract:
A thermocouple assembly may feature a plurality of temperature sensors formed by thermocouple junctions. The sensors may be disposed within an inner diameter of the tubular element and sealed within the tubular element by thermally conductive material. An air gap may be defined by the thermally conductive material and the interior diameter of the tubular element between each pair of adjacent temperature sensors to improve thermal isolation.
Public/Granted literature
- US20190212207A1 THERMALLY ISOLATED THERMOCOUPLE Public/Granted day:2019-07-11
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