Invention Grant
- Patent Title: Strain gauge with mechanically decoupled temperature sensor
-
Application No.: US17018276Application Date: 2020-09-11
-
Publication No.: US11054319B2Publication Date: 2021-07-06
- Inventor: Daniele Caltabiano
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Slater Matsil, LLP
- Main IPC: G01L1/22
- IPC: G01L1/22 ; G01B7/16 ; G01D5/16 ; G01L1/04 ; G01L1/06 ; G01L1/18 ; G01L19/00 ; G01L9/04 ; G01L9/00
Abstract:
A semiconductor device includes a strain gauge on a substrate, the strain gauge configured to measure a stress of the substrate; and a temperature sensor disposed within the substrate, the temperature sensor being decoupled from the stress of the substrate.
Information query
