An electronic device includes a first main body, a second main body, a pivoting mechanism, and a heat dissipation module. The second main body includes a first housing, a second housing, and a cover plate. The pivoting mechanism is pivotally connected between the first main body and the second main body. Two sides of the cover plate are pivotally connected to the second housing and the pivoting mechanism respectively. The heat dissipation module is disposed in the second main body and includes at least one elastic member. The elastic member is fixed between the first housing and the cover plate. In response to that the first main body is in unfolded position relative to the second main body through the pivoting mechanism, the pivoting mechanism drives the cover plate to be located between an open position relative to the second housing, so that the elastic member is stretched.