Invention Grant
- Patent Title: Interface connection apparatus and method
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Application No.: US16741932Application Date: 2020-01-14
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Publication No.: US11055255B2Publication Date: 2021-07-06
- Inventor: Fu-Ching Hsu , Chih-Wei Chang
- Applicant: Realtek Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: Realtek Semiconductor Corporation
- Current Assignee: Realtek Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW108114565 20190425,TW108145582 20191212
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/38 ; G06F13/42

Abstract:
An interface connection apparatus disposed in a first electronic device is provided that includes an analog physical layer circuit, a waveform generation circuit and a media access control circuit. The analog physical layer circuit receives an analog handshake signal from a second electronic device and generates a digital handshake signal. The waveform generation circuit determines whether a matching times that a pulse parameter of each of pulses included in the digital handshake signal is within a predetermined pulse parameter range reaches predetermine times and generates a digital output signal when the matching times reaches the predetermine times, and an output pulse parameter of all output pulses of the digital output signal is within the predetermined pulse parameter range. The media access control circuit determines that the analog handshake signal is valid when the media access control circuit receives the digital output signal to keep performing handshake.
Public/Granted literature
- US20200341936A1 INTERFACE CONNECTION APPARATUS AND METHOD Public/Granted day:2020-10-29
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