The present disclosure provides an image processing system and method. The system includes an image capturing unit and an image processing unit. The image capturing unit includes a camera, a light source, and a wafer transfer stage. The camera captures an image of a wafer mark. The light source is capable of projecting through a plurality of chemical residues on the wafer mark. The image processing unit includes an image processor and an object matching subsystem. The image processor is configured to perform calculations of the image processing unit to generate an output result. The object matching subsystem includes an object matching unit and a memory unit. The object matching unit includes an artificial intelligence (AI) statistical model for identifying each character of the wafer mark. The memory unit stores a set of probabilities of the object matching unit detecting each character of the wafer mark in each image.