Invention Grant
- Patent Title: Thin-film resistors with flexible terminal placement for area saving
-
Application No.: US16800949Application Date: 2020-02-25
-
Publication No.: US11056253B2Publication Date: 2021-07-06
- Inventor: Harikrishna Chintarlapalli Reddy , Alvin Leng Sun Loke
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Chui-kiu T. Wong
- Main IPC: H01C1/01
- IPC: H01C1/01 ; H01L27/01

Abstract:
An apparatus including a dielectric layer; and a set of thin-film resistors arranged in a row extending in a first direction on the dielectric layer, wherein lengths of the set of thin-film resistors in a second direction substantially orthogonal to the first direction are substantially the same, wherein the set of thin-film resistors includes a first subset of one or more thin-film resistors with respective terminals spaced apart by a first distance, and wherein the set of thin-film resistors includes a second subset of one or more thin-film resistors with respective terminals spaced apart by a second distance, the first distance being different than the second distance.
Public/Granted literature
- US20200303094A1 THIN-FILM RESISTORS WITH FLEXIBLE TERMINAL PLACEMENT FOR AREA SAVING Public/Granted day:2020-09-24
Information query