Invention Grant
- Patent Title: Coil pattern and formation method therefor, and chip element having same
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Application No.: US16077725Application Date: 2017-03-13
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Publication No.: US11056271B2Publication Date: 2021-07-06
- Inventor: In Kil Park , Seung Hun Cho , Gyeong Tae Kim , Jun Ho Jung , Sang Jun Park
- Applicant: MODA-INNOCHIPS CO., LTD.
- Applicant Address: KR Ansan-Si
- Assignee: MODA-INNOCHIPS CO., LTD.
- Current Assignee: MODA-INNOCHIPS CO., LTD.
- Current Assignee Address: KR Ansan-Si
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2016-0032204 20160317
- International Application: PCT/KR2017/002661 WO 20170313
- International Announcement: WO2017/160032 WO 20170921
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/29 ; H01F27/32 ; H01F41/04 ; H01L23/64
Abstract:
Provided is a coil pattern formed on at least one surface of a substrate and including a first plating film formed on the substrate and a second plating film formed to cover the first plating film, a method of forming the coil pattern, and a chip device provided with the coil pattern.
Public/Granted literature
- US20200335254A1 COIL PATTERN AND FORMATION METHOD THEREFOR, AND CHIP ELEMENT HAVING SAME Public/Granted day:2020-10-22
Information query
