A semiconductor pick and place apparatus comprises: a pick arm having a main body, and a conduit incorporated in the main body for permitting fluid flow through the main body via the conduit, the conduit further defining a holding orifice which is operative in use to secure a semiconductor die, the conduit being configured to convey light received from one side of the pick arm through the holding orifice and an alignment window located on the main body to an opposite side of the pick arm.