Invention Grant
- Patent Title: Gate-all-around devices having gate dielectric layers of varying thicknesses and method of forming the same
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Application No.: US16728154Application Date: 2019-12-27
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Publication No.: US11056396B1Publication Date: 2021-07-06
- Inventor: Pei-Hsun Wu , Ming-Hung Han , Po-Nien Chen , Chih-Yung Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/10 ; H01L29/423

Abstract:
A semiconductor device includes a substrate; an I/O device over the substrate; and a core device over the substrate. The I/O device includes a first gate structure having an interfacial layer; a first high-k dielectric stack over the interfacial layer; and a conductive layer over and in physical contact with the first high-k dielectric stack. The core device includes a second gate structure having the interfacial layer; a second high-k dielectric stack over the interfacial layer; and the conductive layer over and in physical contact with the second high-k dielectric stack. The first high-k dielectric stack includes the second high-k dielectric stack and a third dielectric layer.
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