Invention Grant
- Patent Title: Chip, manufacturing method, and mobile terminal
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Application No.: US16870115Application Date: 2020-05-08
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Publication No.: US11056479B2Publication Date: 2021-07-06
- Inventor: Jian Bai
- Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Applicant Address: CN Guangdong
- Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Current Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Current Assignee Address: CN Guangdong
- Priority: CN201710147079.4 20170313
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L21/822 ; G06F30/392 ; C30B15/00 ; H01L21/78 ; C30B29/06

Abstract:
In a chip, a manufacturing method, and a mobile terminal, the chip includes a first region and a second region. The first region is formed by at least one first circuit unit set. The second region is formed by a second circuit unit set. The at least one first circuit unit set includes a plurality of identical circuit units. A number of circuit units in the first region determines a specification of the chip and a size of the first region of the chip.
Public/Granted literature
- US20200266186A1 CHIP, MANUFACTURING METHOD, AND MOBILE TERMINAL Public/Granted day:2020-08-20
Information query
IPC分类: