Invention Grant
- Patent Title: Semiconductor device having three-dimensional structure and method of manufacturing the same
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Application No.: US16595379Application Date: 2019-10-07
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Publication No.: US11056485B2Publication Date: 2021-07-06
- Inventor: Hae Ri Kim , Tae Jun You , Ju Ry Song
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Priority: KR10-2018-0164173 20181218
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/3205 ; H01L21/28 ; H01L29/66 ; H01L27/102 ; H01L27/105 ; H01L29/40 ; H01L21/822

Abstract:
A semiconductor device having a three-dimensional structure is disclosed herein. The semiconductor device includes a substrate. a first electrode line that extends in a first direction perpendicular to the substrate, a device pattern that extends from the first electrode line in a second direction parallel to the substrate, and a second electrode line connected to the device pattern. The device pattern may comprise at least one semiconductor layer pattern, where the at least one semiconductor layer pattern comprises an n-type dopant or a p-type dopant.
Information query
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