Invention Grant
- Patent Title: Device substrate
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Application No.: US16447999Application Date: 2019-06-21
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Publication No.: US11056512B2Publication Date: 2021-07-06
- Inventor: Shin-Wei Huang , Ching-Kun Lai , Chen-Shun Tsai
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW107147481 20181227
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L23/498 ; H01L21/66 ; G02F1/1345 ; G02F1/1339

Abstract:
A device substrate includes a first substrate, an active device array, a data line pad, a gate drive circuit test line, and a first barrier structure. The active device array is located on the first substrate. The data line pad is electrically connected to the active device array. The gate drive circuit test line is located on the first substrate. The first barrier structure is located on the first substrate. The first barrier structure is located between the gate drive circuit test line and the data line pad. The barrier structure includes a first blocking wall.
Public/Granted literature
- US20200168632A1 DEVICE SUBSTRATE Public/Granted day:2020-05-28
Information query
IPC分类: