Invention Grant
- Patent Title: Semiconductor structure with metal connection layer
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Application No.: US16526761Application Date: 2019-07-30
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Publication No.: US11056530B2Publication Date: 2021-07-06
- Inventor: De Kui Qi
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai; CN Beijing
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201710163795.1 20170317
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L21/266

Abstract:
A semiconductor structure is provided and includes: a substrate, containing first doping ions and including a photosensitive region and a floating diffusion region; a deeply doped region, in the photosensitive region of the substrate and containing second doping ions; a floating diffusion area, in the floating diffusion region of the substrate and containing third doping ions; a gate structure on the substrate at a junction of the photosensitive region and the floating diffusion region; a sidewall spacer on the photosensitive region of the substrate, and on sidewalls and top of the gate structure in the photosensitive region; a first doped region located in the floating diffusion area and having fourth doping ions; a metal connection layer on the first doped region; an interlayer dielectric layer on the substrate exposed by the gate structure; and a contact plug, in the interlayer dielectric layer and electrically connected to the metal connection layer.
Public/Granted literature
- US20190355781A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2019-11-21
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