Invention Grant
- Patent Title: Method of fabricating a monolithic sensor device from a layered structure
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Application No.: US16619444Application Date: 2018-06-01
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Publication No.: US11056531B2Publication Date: 2021-07-06
- Inventor: David Robert Sime Cumming , Chengzhi Xie , Vincenzo Pusino
- Applicant: The University Court of the University of Glasgow
- Applicant Address: GB Glasgow
- Assignee: The University Court of the University of Glasgow
- Current Assignee: The University Court of the University of Glasgow
- Current Assignee Address: GB Glasgow
- Agency: Troutman Pepper Hamilton Sanders LLP
- Priority: GB1709006 20170606
- International Application: PCT/EP2018/064464 WO 20180601
- International Announcement: WO2018/224403 WO 20181213
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L21/02 ; H01L31/0304 ; H01L31/103

Abstract:
A method of fabricating a field-effect transistor in which a native oxide layer is removed prior to etching a gate recess. The cleaning step ensures that the etch of the gate recess starts at the same time across an entire sample, such that a uniform gate recess depth and profile can be achieved across an array of field-effect transistors. This results in a highly uniform switch-off voltage for the field-effect transistors in the array.
Public/Granted literature
- US20200168659A1 METHOD OF FABRICATING A MONOLITHIC SENSOR DEVICE FROM A LAYERED STRUCTURE Public/Granted day:2020-05-28
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