Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US16696242Application Date: 2019-11-26
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Publication No.: US11056587B2Publication Date: 2021-07-06
- Inventor: Hui Chul Shin , Woo Yeol Maeng
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2019-0044091 20190416
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/40

Abstract:
A semiconductor device includes an active region defined by an element isolation region in a base substrate, source and drain regions of a first conductivity type spaced apart from each other, and formed in the active region, a body region of a second conductivity type surrounding the source region, and formed in the base substrate, a drift region of the first conductivity type surrounding the drain region, having a lower impurity concentration than the drain region, and formed in the base substrate, an insulating structure including a buried insulating pattern and a semiconductor pattern sequentially stacked on the drift region, a gate dielectric film including a first portion extending along an upper surface of the body region and a second portion extending along a side surface and an upper surface of the insulating structure, and a gate electrode extending along an upper surface of the gate dielectric film.
Public/Granted literature
- US20200335623A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2020-10-22
Information query
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