An electrode plate processing device is provided. The electrode plate processing device includes: an electrode plate conveying mechanism configured to convey an electrode plate; a cutting mechanism disposed opposite to the electrode plate and configured to cut the electrode plate to form a tab; and a waste adsorption mechanism disposed downstream of the cutting mechanism along a conveying direction of the electrode plate. The waste adsorption mechanism includes an active driving roller, a driven support roller, and a conveyer belt that is coupled to the active driving roller and the driven support roller in a transmission way. The conveyer belt is driven by the active driving roller to rotate and configured to provide an adsorption force to a waste edge produced during the cutting of the electrode plate so as to adsorb the waste edge.