Invention Grant
- Patent Title: Connection structure
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Application No.: US16720242Application Date: 2019-12-19
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Publication No.: US11057992B2Publication Date: 2021-07-06
- Inventor: Sakae Tanaka
- Applicant: Mikuni Electron Corporation
- Applicant Address: JP Saitama
- Assignee: Mikuni Electron Corporation
- Current Assignee: Mikuni Electron Corporation
- Current Assignee Address: JP Saitama
- Agency: Pearne & Gordon LLP
- Priority: JPJP2018-015665 20180131
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/09 ; H05K1/11 ; H05K1/18 ; H05K3/00 ; H05K3/30 ; H05K3/32 ; H05K3/34 ; H05K3/36 ; H01L21/00 ; H01L21/02 ; H01L21/50 ; H01L21/56 ; H01L21/60 ; H01L23/48 ; H01L23/485 ; H01L23/498 ; H05K1/03 ; H05K3/10
Abstract:
A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member; and curing the first composite and the second composite.
Information query
