Invention Grant
- Patent Title: Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portions
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Application No.: US16182455Application Date: 2018-11-06
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Publication No.: US11058007B2Publication Date: 2021-07-06
- Inventor: Marco Gavagnin , Markus Leitgeb , Alexander Kasper , Gernot Schulz
- Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicant Address: AT Leoben
- Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: EP17200200 20171106
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L21/48 ; H01L23/538 ; H05K1/02 ; H05K3/46
Abstract:
A component carrier with a) a first component carrier portion having a blind opening; b) a component arranged in the blind opening; and c) a second component carrier portion at least partially filling the blind opening. At least one of the first component carrier portion and the second component carrier portion includes a flexible component carrier material, and the first component carrier portion and the second component carrier portion form a stack of a plurality of electrically insulating layer structures and/or electrically conductive layer structures. It is further described a method for manufacturing such a component carrier.
Public/Granted literature
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