A manufacturing method, Printed Circuit Board (PCB) panel, and a PCB are disclosed. The method includes forming a cavity in a PCB that is in a PCB panel that includes a frame and stays, mounting an electronic component, heating the PCB panel, and cutting the stays. The PCB panel includes a frame body and a PCB coupled to the frame body via stays. The PCB includes a cavity. A first cavity stay is located near the cavity. Extended lines extend from the cavity, and the cavity stay extends at least between the extended lines. The PCB includes a cavity and a connection point from a cavity stay near the cavity.