Invention Grant
- Patent Title: Component carrier comprising a photo-imageable dielectric and method of manufacturing the same
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Application No.: US16689511Application Date: 2019-11-20
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Publication No.: US11058009B2Publication Date: 2021-07-06
- Inventor: Jeesoo Mok
- Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicant Address: AT Leoben
- Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: CN201811386322.9 20181120
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/46 ; H05K3/00 ; H05K3/40 ; H05K1/11 ; H05K1/05 ; H05K1/02 ; H05K1/18 ; G03F7/26 ; G03F7/20
Abstract:
A method of manufacturing a component carrier is disclosed. The method includes forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; patterning a front side of the stack using a first photo-imageable dielectric; and patterning a back side of the stack. A component carrier is also disclosed.
Public/Granted literature
- US20200163218A1 Component Carrier Comprising a Photo-Imageable Dielectric and Method of Manufacturing the Same Public/Granted day:2020-05-21
Information query
