Invention Grant
- Patent Title: Prepreg, metal-clad laminated board, and printed wiring board
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Application No.: US16316579Application Date: 2017-07-19
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Publication No.: US11059260B2Publication Date: 2021-07-13
- Inventor: Keiko Kashihara , Takashi Hoshi , Hiroharu Inoue
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott and Emery LLP
- Priority: JPJP2016-150047 20160729
- International Application: PCT/JP2017/026113 WO 20170719
- International Announcement: WO2018/021113 WO 20180201
- Main IPC: B32B5/02
- IPC: B32B5/02 ; B32B15/14 ; C08J5/24 ; H05K1/03 ; B32B15/08 ; B32B15/092 ; C08L63/00 ; C08K3/36 ; C08K5/5399 ; C08K9/06

Abstract:
A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2).
Public/Granted literature
- US20190263087A1 PREPREG, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD Public/Granted day:2019-08-29
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