Devices, methods, and systems for two-phase thermal management are provided in accordance with various embodiments. For example, a two-phase thermal management device is provided that may include two or more containment layers and/or one or more porous layers positioned between at least a portion of each of the two or more containment layers. The portion of each of the two or more containment layers and the one or more porous layers may be bonded with each other. The two or more containment layers and one or more porous layers may be bonded with each other to form an uninterrupted stack of material layers utilizing diffusion bonding. Some embodiments include a method of forming a two-phase thermal management device including arranging multiple materials layers including one or more porous layers positioned with respect to one or more containment layers; and/or bonding the multiple material layers with each other.