Invention Grant
- Patent Title: Electronic module
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Application No.: US16739326Application Date: 2020-01-10
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Publication No.: US11059437B2Publication Date: 2021-07-13
- Inventor: Yoshiki Yanagita , Takumi Ejima
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Mie
- Agency: Honigman LLP
- Priority: JPJP2019-029389 20190221
- Main IPC: H01R12/00
- IPC: H01R12/00 ; B60R16/023 ; H05K5/02

Abstract:
Provided is an electronic module that can be made more compact. A vehicle electronic module includes a casing that is to be fixed to an object, the casing including a first plate portion facing the object and a ceiling plate opposed to the first plate portion, wherein the electronic module includes: a connection portion that is provided on the ceiling plate, and to which an external connector is to be connected; and a fuse portion disposed overlapping the connection portion in an opposing direction of the first plate portion and the ceiling plate.
Public/Granted literature
- US20200269783A1 ELECTRONIC MODULE Public/Granted day:2020-08-27
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