Invention Grant
- Patent Title: Thermally conductive composition
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Application No.: US16629162Application Date: 2017-09-29
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Publication No.: US11059971B2Publication Date: 2021-07-13
- Inventor: Zhihua Liu , Peng Wei , Hexiang Yan , Yi Zhao , Qi Chen , Junmin Zhu
- Applicant: Dow Silicones Corporation
- Applicant Address: US MI Midland
- Assignee: Dow Silicones Corporation
- Current Assignee: Dow Silicones Corporation
- Current Assignee Address: US MI Midland
- International Application: PCT/CN2017/104360 WO 20170929
- International Announcement: WO2019/061288 WO 20190404
- Main IPC: C08L83/04
- IPC: C08L83/04 ; C08K3/013 ; C08G77/12 ; C08G77/18 ; C08G77/20 ; C08G77/00 ; C08K3/36
Abstract:
Provided are a composition, a cured polymer material formed from said composition, a method for forming a thermally conductive material on an article and an article having a thermally conductive material. Said thermally conductive material can be formed on an electronic device, and can be peeled off from said electronic device.
Public/Granted literature
- US20200308404A1 THERMALLY CONDUCTIVE COMPOSITION Public/Granted day:2020-10-01
Information query
