- Patent Title: Organic-inorganic composite particles and manufacturing method therefor, and thermally conductive filler and thermally conductive resin composition and manufacturing method therefor
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Application No.: US16491335Application Date: 2018-03-30
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Publication No.: US11060007B2Publication Date: 2021-07-13
- Inventor: Kengo Nishiumi
- Applicant: SEKISUI KASEI CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI KASEI CO., LTD.
- Current Assignee: SEKISUI KASEI CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2017-072451 20170331
- International Application: PCT/JP2018/013848 WO 20180330
- International Announcement: WO2018/181984 WO 20181004
- Main IPC: C08K9/04
- IPC: C08K9/04 ; C09K5/14 ; C08K3/22

Abstract:
Organic-inorganic composite particles include: a vinyl polymer that is a polymer of a polymerizable vinyl monomer; and inorganic particles including inorganic oxide and/or inorganic nitride. The thermal conductivity of the inorganic particles is 10 W/(m·K) or more. The inorganic particles are subjected to a surface treatment by acidic phosphoric acid ester having no polymerizable functional group, and by at least one polymerizable compound selected from the group consisting of: carboxylic acid having a polymerizable functional group; acidic phosphoric acid ester having a polymerizable functional group; and lactone having a polymerizable functional group. The polymerizable compound is bonded to the vinyl polymer, and the inorganic particles are unevenly located on surface layers of the organic-inorganic composite particles so that the inorganic particles form one or more layers.
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