Invention Grant
- Patent Title: Loop heat pipe
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Application No.: US16351724Application Date: 2019-03-13
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Publication No.: US11060797B2Publication Date: 2021-07-13
- Inventor: Yoshihiro Machida
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: Tarolli, Sundheim, Covell & Tummino LLP
- Priority: JPJP2018-049326 20180316
- Main IPC: F28D15/02
- IPC: F28D15/02 ; F28F19/00

Abstract:
A loop heat pipe includes a metal layer stack of outermost metal layers and intermediate metal layers. The metal layer stack includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe connecting the evaporator to the condenser, and a liquid pipe connecting the condenser to the evaporator. The vapor pipe includes two pipe walls defining a flow passage of the vapor pipe and joint beams arranged at different positions along the flow passage. Each of the joint beams joins the two pipe walls to each other. Each of the intermediate metal layers includes one of the joint beams. Each of the joint beams includes a side surface that is inclined.
Public/Granted literature
- US20190285354A1 LOOP HEAT PIPE Public/Granted day:2019-09-19
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